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Home
Introduction
Overview
N-Lab.
Contact Us
Research
Thermal Barrier Coating & Mold Binder System
Organic / Inorganic Hybrid Coating
Ceramic Powder Synthesis
Equipment in Lab.
People
Professor
Researchers
Ph.D. Candidates
M.S. Candidates
Alumni
Publication
International Journal
International Conference
Domestic
Patents
Book/Book Chapters
Community
News & Notice
Lecture Board
Member Board
Partners
Gallery
Lab. Only
Monthly Schedule
Project
Data Room
Notice
Functional Nano Structure Materials Lab.
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International Journal
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International Journal
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> > > A ceramic core must have a high fracture strength before and after heat treatment to reasonably handle the complex and thin parts. To develop such a ceramic core, herein, a photocurable monomer with high network density was applied as an organic binder to increase green strength, and an inorganic binder was additionally introduced to minimize the shape distortion of the core due to the organic–inorganic conversion process. Fused silica beads as a starting material and trifunctional and monofunctional acrylate as an organic binder were used; these slurries with various compositions formed the green body of the core shaped through a pressing process. Next, the green body was subjected to UV irradiation for 10 min to photopolymerize the monomer, followed by heat treatment at 900 °C for 1 h to convert the inorganic binder into a glass phase and to decompose the polymer. The as-prepared ceramic core exhibited a high strength of ∼20 MPa before heat treatment owing to the presence of the crosslinked polymer with high network density. By converting the inorganic binder into a glass phase, it was possible to manufacture the ceramic core at a strength of ∼40 MPa. The photopolymerization behavior of monofunctional and trifunctional acrylate monomers and a mixture of both monomers was analyzed by FT-IR spectroscopy, and the thermal behavior of each ceramic core sample was analyzed by TG-DTA. The relationship between the polymerization degree of the photocurable monomer and strength was investigated via thermal analysis and microstructure measurement. > >
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